- 专利标题: Lateral semiconductor device and method of manufacture
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申请号: US17273634申请日: 2019-09-05
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公开(公告)号: US11581402B2公开(公告)日: 2023-02-14
- 发明人: Qin Huang
- 申请人: The University of Texas at Austin
- 申请人地址: US TX Austin
- 专利权人: The University of Texas at Austin
- 当前专利权人: The University of Texas at Austin
- 当前专利权人地址: US TX Austin
- 代理机构: Patterson + Sheridan, LLP
- 国际申请: PCT/US2019/049672 WO 20190905
- 国际公布: WO2020/051285 WO 20200312
- 主分类号: H01L29/40
- IPC分类号: H01L29/40 ; H01L29/872 ; H01L29/06 ; H01L29/16 ; H01L29/78
摘要:
A method and apparatus include an n-doped layer having a first applied charge, and a p−-doped layer having a second applied charge. The p−-doped layer may be positioned below the n-doped layer. A p+-doped buffer layer may have a third applied charge and be positioned below the p−-doped layer. The respective charges at each layer may be determined based on a dopant level and a physical dimension of the layer. In one example, the n-doped layer, the p−-doped layer, and the p+-doped buffer layer comprise a lateral semiconductor manufactured from silicon carbide (SiC).
公开/授权文献
- US20210343836A1 LATERAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE 公开/授权日:2021-11-04
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