- 专利标题: Robot apparatus for producing electronic apparatus
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申请号: US16609821申请日: 2018-04-13
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公开(公告)号: US11581690B2公开(公告)日: 2023-02-14
- 发明人: Shinichi Takeyama , Hirokuni Beppu
- 申请人: SONY CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: SONY CORPORATION
- 当前专利权人: SONY CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Chip Law Group
- 优先权: JPJP2017-092947 20170509
- 国际申请: PCT/JP2018/015518 WO 20180413
- 国际公布: WO2018/207552 WO 20181115
- 主分类号: H01R43/26
- IPC分类号: H01R43/26 ; B25J11/00 ; B25J15/08 ; H01R12/79
摘要:
A robot apparatus includes a clamp mechanism; a transport mechanism; and a control unit. The clamp mechanism includes a first finger that has a first support surface and a housing portion and a second finger. The first support surface supports an aligned wire group that includes a plurality of wires, the housing portion includes a guide wall that is connected to the first support surface and regulates an amount of movement of the band member in a width direction. The second finger has a second support surface facing the first support surface and a facing portion being connected to the second support surface and facing the housing portion. The transport mechanism is capable of moving the clamp mechanism. The control unit controls a grip force of the clamp mechanism and a direction of movement of the clamp mechanism by the transport mechanism.