Invention Grant
- Patent Title: Coil component
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Application No.: US16287408Application Date: 2019-02-27
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Publication No.: US11587722B2Publication Date: 2023-02-21
- Inventor: Ju Hwan Yang , Byung Soo Kang , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0083387 20180718
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F27/02 ; H01F27/36

Abstract:
A coil component includes a body having one surface and the other surface opposing each other in one direction, and a plurality of walls each connecting the one surface to the other surface; a coil portion buried in the body, and having both ends exposing to one of the plurality of walls of the body; first and second external electrodes respectively including first and second terminal electrodes disposed on one surface of the body and spaced apart from each other, and first and second connection electrodes respectively connecting the first and second terminal electrodes to both ends of the coil portion; a first external insulating layer disposed on the other surface of the body; and a first shielding layer disposed on the external insulating layer.
Public/Granted literature
- US20200027649A1 COIL COMPONENT Public/Granted day:2020-01-23
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