Invention Grant
- Patent Title: Package structures having underfills
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Application No.: US17168238Application Date: 2021-02-05
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Publication No.: US11587906B2Publication Date: 2023-02-21
- Inventor: Jinwoo Park , Unbyoung Kang , Jongho Lee , Teakhoon Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2020-0085452 20200710
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/367 ; H01L23/16 ; H01L23/31 ; H01L23/00

Abstract:
A package structure includes a lower substrate, substrate connection terminals on the lower substrate, a semiconductor package on the substrate connection terminals, the semiconductor package including a package substrate and a first encapsulant covering the package substrate, first underfills between the lower substrate and the semiconductor package, the first underfills covering corner portions of the semiconductor package, as viewed in a plan view, and covering at least one of the substrate connection terminals, and a second underfill between the lower substrate and the semiconductor package, the second underfill covering a side surface of the semiconductor package in a plan view.
Public/Granted literature
- US20220013496A1 PACKAGE STRUCTURES HAVING UNDERFILLS Public/Granted day:2022-01-13
Information query
IPC分类: