Invention Grant
- Patent Title: Functional assembly and electronic device with the functional assembly
-
Application No.: US16811114Application Date: 2020-03-06
-
Publication No.: US11592866B2Publication Date: 2023-02-28
- Inventor: Cheng-Han Chung , Chui-Hung Chen , Chia-Min Cheng , Ching-Yuan Yang
- Applicant: ASUSTeK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTeK COMPUTER INC.
- Current Assignee: ASUSTeK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW108202840 20190308
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H04M1/02

Abstract:
A functional assembly and an electronic device including the functional assembly are provided. The functional assembly includes a functional module, a motor, and a linking mechanism. The functional module has a first shaft. The motor has a second shaft and is configured to drive the second shaft to rotate. The linking mechanism is connected with the first shaft and the second shaft such that the first shaft and the second shaft are linking-up with each other. As a result, the thickness of the electronic device near the frame is not limited by the size of the motor, which further reduces the thickness of the electronic device.
Public/Granted literature
- US20200288002A1 FUNCTIONAL ASSEMBLY AND ELECTRONIC DEVICE WITH THE FUNCTIONAL ASSEMBLY Public/Granted day:2020-09-10
Information query