- 专利标题： Integrated antenna module
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申请号： US16825615申请日： 2020-03-20
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公开(公告)号： US11594824B2公开(公告)日： 2023-02-28
- 发明人: Julio Zegarra , Peter Lien , Sang-June Park , Darryl Sheldon Jessie , Alberto Cicalini , Sean Oak , Neil Burns
- 申请人： QUALCOMM Incorporated
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理机构： Muncy, Geissler, Olds & Lowe P.C
- 主分类号： H01Q1/52
- IPC分类号： H01Q1/52 ; H01Q23/00 ; H01Q1/48 ; H05K1/18
摘要：
An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.
公开/授权文献
- US20210119350A1 INTEGRATED ANTENNA MODULE 公开/授权日：2021-04-22
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