A sensor module includes a base member and a sensor, wherein the base member is a molded component on which pattern wiring is directly formed, wherein the base member includes at least a principal surface, a first side wall orthogonal to the principal surface, and a second side wall orthogonal to the principal surface and the first side wall, and wherein a larger one of a width of the first side wall and a width of the second side wall in a first direction perpendicular to the principal surface is larger than a width of the principal surface in the first direction.