Invention Grant
- Patent Title: Coil component
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Application No.: US16572853Application Date: 2019-09-17
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Publication No.: US11600437B2Publication Date: 2023-03-07
- Inventor: Byung Soo Kang , Byeong Cheol Moon , Tae Jun Choi , Ju Hwan Yang
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0002630 20190109
- Main IPC: H01F41/00
- IPC: H01F41/00 ; H01F17/04 ; H01F27/02 ; H01F27/29 ; H01F27/30 ; H01F27/32 ; H01F41/12

Abstract:
A coil component includes a molded portion having one surface and another surface opposing each other, and a wound coil disposed on the one surface of the molded portion and including an innermost turn, at least one intermediate turn, and an outermost turn disposed outwardly of a central portion of the one surface of the molded portion. A cover portion is disposed to face the one surface of the molded portion and to cover the wound coil, and first and second external electrodes are connected to the wound coil and arranged to be spaced apart from each other on the other surface of the molded portion. A thickness of one region of the cover portion disposed on the innermost turn is thicker than a thickness of another region of the cover portion disposed on the outermost turn.
Public/Granted literature
- US20200219651A1 Coil Component Public/Granted day:2020-07-09
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