Invention Grant
- Patent Title: Wafer pod transfer assembly
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Application No.: US17382506Application Date: 2021-07-22
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Publication No.: US11600506B2Publication Date: 2023-03-07
- Inventor: Chih-Wei Chou , Sheng-Yuan Lin , Yuan-Hsin Chi , Yin-Tun Chou , Hung-Chih Wang , Yu-Chi Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B65G47/90

Abstract:
A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.
Public/Granted literature
- US20220344191A1 WAFER POD TRANSFER ASSEMBLY Public/Granted day:2022-10-27
Information query
IPC分类: