Invention Grant
- Patent Title: Additive supports with integral film cooling
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Application No.: US17270261Application Date: 2018-08-31
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Publication No.: US11603764B2Publication Date: 2023-03-14
- Inventor: Thomas Earl Dyson , Joseph I Block , Brendon James Leary , Lyndsay Marie Kibler
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Schenectady
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Schenectady
- Agency: Hoffman Warnick LLC
- Agent James Pemrick; Charlotte Wilson
- International Application: PCT/US2018/049274 WO 20180831
- International Announcement: WO2020/046396 WO 20200305
- Main IPC: F01D5/18
- IPC: F01D5/18

Abstract:
An article of manufacture includes an article body portion (36); at least one pedestal (58A, 60A, 84, 86) integrally formed with the article body portion (36), and disposed at an outer periphery of (52), and structurally coupled to the article body portion (36); and at least one internal feature (72) disposed at least partially within the article body portion (36) and at least partially within the pedestal (58A, 60A, 84, 86). At least a portion of the internal feature (72) is hollow.
Public/Granted literature
- US20210254475A1 ADDITIVE SUPPORTS WITH INTEGRAL FILM COOLING Public/Granted day:2021-08-19
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