Invention Grant
- Patent Title: Electronic device with heat-radiant structure
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Application No.: US16840037Application Date: 2020-04-03
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Publication No.: US11604256B2Publication Date: 2023-03-14
- Inventor: Jaeyoung Huh , Kyungwan Park , Jungho Bae , Boram Kim , Youngjin Kim , Hyun Kim , Byeonghoon Park , Yoonsun Park , Woontahk Sung , Kyungwoo Lee , Kihoon Jang , Younho Choi
- Applicant: Samsung Electronics Co., Ltd. , Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si; KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.,Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.,Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si; KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2019-0039861 20190404
- Main IPC: G01S7/481
- IPC: G01S7/481 ; H01S5/024 ; H05K5/00 ; H05K1/02 ; H05K1/14 ; G03B17/55 ; H01S5/02 ; H05K7/20 ; G01S17/10 ; H01S5/023 ; H01S5/0233 ; H01S5/0235

Abstract:
An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.
Public/Granted literature
- US20200319307A1 ELECTRONIC DEVICE WITH HEAT-RADIANT STRUCTURE Public/Granted day:2020-10-08
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