Invention Grant
- Patent Title: Surface wave excitation device having a multi-layer PCB construction with closed regions therein
-
Application No.: US17202916Application Date: 2021-03-16
-
Publication No.: US11605870B2Publication Date: 2023-03-14
- Inventor: Yue Wen , Chao Wang
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Main IPC: H01P3/10
- IPC: H01P3/10 ; H05K1/02

Abstract:
A surface wave excitation device includes a transmission line disposed on a wire layer PCB, and a same quantity of layers are respectively disposed above and below the wire layer PCB. A copper wire is disposed on each layer of PCB, and the copper wire forms a closed region. Closed regions on the PCB that are respectively disposed above and below the wire layer PCB and that have a same distance from the wire layer PCB are in a same shape, and a closed region on a PCB farther away from the wire layer PCB occupies a larger area. The wire layer PCB includes first and second closed regions, the first closed region is disposed on one side of the transmission line, and the second closed region is disposed on the other side, and shapes of the first and second closed regions are mutually symmetrical with the transmission line as a symmetry axis.
Public/Granted literature
- US20210204392A1 SURFACE WAVE EXCITATION DEVICE AND PRINTED CIRCUIT BOARD Public/Granted day:2021-07-01
Information query