- 专利标题： Battery control system-in-package and method of fabricating the same
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申请号： US17159729申请日： 2021-01-27
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公开(公告)号： US11605959B2公开(公告)日： 2023-03-14
- 发明人: Hyuk Hwi Na , Ho Seok Hwang , Ja Guen Gu , Chi Sun Song , Seong Beom Park , Sun Ho Kim
- 申请人： ITM SEMICONDUCTOR CO., LTD.
- 申请人地址： KR Chungcheongbuk-do
- 专利权人： ITM SEMICONDUCTOR CO., LTD.
- 当前专利权人： ITM SEMICONDUCTOR CO., LTD.
- 当前专利权人地址： KR Chungcheongbuk-do
- 代理机构： Mayer & Williams, PC
- 代理商 Stuart H. Mayer
- 优先权： KR10-2020-0019898 20200218
- 主分类号： H02J7/04
- IPC分类号： H02J7/04 ; H02J7/00 ; H02J7/02 ; H01L25/00 ; H01L25/065 ; H01L23/495
摘要：
Provided is a battery control system-in-package including a package substrate, a wireless charger integrated circuit (IC) module mounted on the package substrate, a wired charger IC module mounted on the package substrate, a battery protection IC module mounted on the package substrate, and a single mold provided on the package substrate to encapsulate the wireless charger IC module, the wired charger IC module, and the battery protection IC module.
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