Invention Grant
- Patent Title: Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture
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Application No.: US17591706Application Date: 2022-02-03
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Publication No.: US11609131B2Publication Date: 2023-03-21
- Inventor: Albert Bergemont , Julius Minglin Tsai
- Applicant: NEXTINPUT, INC.
- Applicant Address: US CA Mountain View
- Assignee: NEXTINPUT, INC.
- Current Assignee: NEXTINPUT, INC.
- Current Assignee Address: US CA Mountain View
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: G01L1/16
- IPC: G01L1/16 ; G01L1/18 ; H01L41/113

Abstract:
Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor. The sensor employs piezoresistive or piezoelectric sensing elements for force sensing where the force is converted to strain and converted to electrical signal. In one aspect, both the piezoresistive and the piezoelectric sensing elements are formed on one substrate and later bonded to another substrate on which the integrated circuitry is formed. In another aspect, the piezoelectric sensing element is formed on one substrate and later bonded to another substrate on which both the piezoresistive sensing element and the integrated circuitry are formed.
Public/Granted literature
- US20220260435A1 WAFER BONDED PIEZORESISTIVE AND PIEZOELECTRIC FORCE SENSOR AND RELATED METHODS OF MANUFACTURE Public/Granted day:2022-08-18
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