Invention Grant
- Patent Title: Modular form factor of a printed circuit board for an information handling system
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Application No.: US16797256Application Date: 2020-02-21
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Publication No.: US11609617B2Publication Date: 2023-03-21
- Inventor: Yimin Xiao , Jake Hill Lavallo
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: McDermott Will & Emery LLP
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H05K1/02 ; G06T1/20 ; G09G3/30

Abstract:
An information handling system, including two or more single-slot M.2 modules; a dual-slot discrete graphics processing unit (dGPU) module; a printed circuit board, including: a plurality of M.2 connectors aligned on a same edge of the printed circuit board such that: a first single-slot M.2 module of the two or more single-slot M.2 modules is coupled to a first M.2 connector of the plurality of M.2 connectors; a second single-slot M.2 module of the two or more single-slot M.2 modules is coupled to a second M.2 connector of the plurality of M.2 connectors; and the dual-slot dGPU module is coupled to a third and a fourth M.2 connector of the plurality of M.2 connectors.
Public/Granted literature
- US20210263569A1 MODULAR FORM FACTOR OF A PRINTED CIRCUIT BOARD FOR AN INFORMATION HANDLING SYSTEM Public/Granted day:2021-08-26
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