Invention Grant
- Patent Title: Thincloud mesh access point (AP) and internet of things (IoT) device onboarding
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Application No.: US16667690Application Date: 2019-10-29
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Publication No.: US11611874B2Publication Date: 2023-03-21
- Inventor: Tak Ming F. Pang , Ashish Sood , Jie C. Jiang
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: H04W12/06
- IPC: H04W12/06 ; H04W12/65 ; H04W12/71 ; H04W12/77
Abstract:
A computing device determines an onboarding algorithm to use for onboarding a wireless device. The computing device determines, based on the onboarding algorithm, a first set of predefined information and a second set of dynamically generated information to use as inputs to the onboarding algorithm. The computing device generates, via the onboarding algorithm, a set of credentials based on the first set of predefined information and the second set of dynamically generated information, and uses the set of credentials to secure a connection for onboarding the wireless device.
Public/Granted literature
- US20210014681A1 THINCLOUD MESH ACCESS POINT (AP) AND INTERNET OF THINGS (IOT) DEVICE ONBOARDING Public/Granted day:2021-01-14
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