A fingerprint identification module is provided. The fingerprint identification module includes: a base substrate, a first conductive layer, and a third conductive layer that are laminated sequentially. The first conductive layer includes a first signal line and a second signal line, wherein the first signal line extends along a first direction and is connected to a gate of a reset transistor in a pixel sensing circuit, and the second signal line extends along the first direction and is connected to a gate of a switch transistor in the pixel sensing circuit. The third conductive layer includes a first conductive portion configured to form a first electrode of a photodiode in the pixel sensing circuit, wherein an orthographic projection of the first conductive portion on the base substrate does not overlap with orthographic projections of the first signal line and the second signal line on the base substrate.