Invention Grant
- Patent Title: Methods for thermal forming an object
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Application No.: US16983876Application Date: 2020-08-03
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Publication No.: US11623368B2Publication Date: 2023-04-11
- Inventor: Yevgeniy Sirovskiy , James C. Culp
- Applicant: Align Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Align Technology, Inc.
- Current Assignee: Align Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Fortem IP LLP
- Main IPC: B29C51/42
- IPC: B29C51/42 ; B29B13/02

Abstract:
Methods for thermal forming an object are provided. In some embodiments, a method includes reading a mold identifier located on or in a mold, and determining mold process information from the mold identifier, the mold process information including heating information. The method can include heating a thermoformable material according to the heating information by adjusting power of one or more independently controllable heat sources. The method can also include monitoring one or more temperatures from a plurality of temperature sensing elements operably coupled to different areas of the thermoformable material. The thermoformable material can be heated according to the heating information and in response to the one or more monitored temperatures such that each of the different areas of the thermoformable material reach a respective desired temperature. The method can further include disposing the heated thermoformable material over at least a portion of the mold to form the object.
Public/Granted literature
- US20210001514A1 METHODS AND SYSTEMS FOR THERMAL FORMING AN OBJECT Public/Granted day:2021-01-07
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