A computing device accesses a machine learning model trained on training data of first bonding operations (e.g., a ball and/or stitch bond). The first bonding operations comprise operations to bond a first set of multiple wires to a first set of surfaces. The machine learning model is trained by supervised learning. The device receives input data indicating process data generated from measurements of second bonding operations. The second bonding operations comprise operations to bond a second set of multiple wires to a second set of surfaces. The device weights the input data according to the machine learning model. The device generates an anomaly predictor indicating a risk for an anomaly occurrence in the second bonding operations based on weighting the input data according to the machine learning model. The device outputs the anomaly predictor to control the second bonding operations.