Invention Grant
- Patent Title: Integrated circuit device
-
Application No.: US17231114Application Date: 2021-04-15
-
Publication No.: US11631674B2Publication Date: 2023-04-18
- Inventor: Minhee Choi , Keunhwi Cho , Myunggil Kang , Seokhoon Kim , Dongwon Kim , Pankwi Park , Dongsuk Shin
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2020-0101392 20200812
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/06 ; H01L29/66 ; H01L29/78

Abstract:
An integrated circuit device includes a fin-type active area along a first horizontal direction on a substrate, a device isolation layer on opposite sidewalls of the fin-type active area, a gate structure along a second horizontal direction crossing the first horizontal direction, the gate structure being on the fin-type active area and on the device isolation layer, and a source/drain area on the fin-type active area, the source/drain area being adjacent to the gate structure, and including an outer blocking layer, an inner blocking layer, and a main body layer sequentially stacked on the fin-type active area, and each of the outer blocking layer and the main body layer including a Si1-xGex layer, where x≠0, and the inner blocking layer including a Si layer.
Information query
IPC分类: