Invention Grant
- Patent Title: Electronic device and mounting structure thereof
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Application No.: US17003117Application Date: 2020-08-26
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Publication No.: US11635166B2Publication Date: 2023-04-25
- Inventor: Yan-Da Chen , Bing-Sheng Hsieh
- Applicant: Wistron NeWeb Corp.
- Applicant Address: TW Hsinchu
- Assignee: Wistron NeWeb Corp.
- Current Assignee: Wistron NeWeb Corp.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW108136148 20191005
- Main IPC: F16M11/00
- IPC: F16M11/00 ; F16M13/02 ; F21V11/00

Abstract:
A mounting structure for connecting an electronic device to a mounting surface is provided. The mounting structure includes a mounting base, a linkage, and a bracket. The first end of the linkage pivots on the mounting base. The bracket is rotatably connected to the second end of the linkage, wherein the bracket includes a cable receiving groove. The electronic device is disposed on the bracket. The electronic device includes a cable. At least a portion of the cable extends into the cable receiving groove.
Public/Granted literature
- US20210102661A1 ELECTRONIC DEVICE AND MOUNTING STRUCTURE THEREOF Public/Granted day:2021-04-08
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