- 专利标题： Dielectric composition and multilayer electronic component including the same
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申请号： US17391321申请日： 2021-08-02
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公开(公告)号： US11636979B2公开(公告)日： 2023-04-25
- 发明人: Hee Sun Chun , Hong Gi Nam , Je Hee Lee , Ji Su Hong , Seung In Baik , Jae Sung Park
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Morgan, Lewis & Bockius LLP
- 优先权： KR10-2020-0171392 20201209
- 主分类号： H01G4/008
- IPC分类号： H01G4/008 ; H01G4/12 ; H01G4/30 ; H01G4/012
摘要：
A dielectric composition includes: a BaTiO3-based main component and a first accessory component, wherein the first accessory component includes dysprosium (Dy) and terbium (Tb), the sum (Dy+Tb) of contents of dysprosium (Dy) and terbium (Tb) is more than 1.5 mol and 2.0 mol or less based on 100 mol of Ti of the main component, and 0.1≤Tb/Dy
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