- 专利标题: Manufacturing method of multilayer ceramic electronic component
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申请号: US17726888申请日: 2022-04-22
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公开(公告)号: US11636983B2公开(公告)日: 2023-04-25
- 发明人: Tae Sung Kim , Hyeong Sik Yun , Woo Chul Shin , Joon Woon Lee
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2019-0094257 20190802
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/012 ; H01G4/12
摘要:
The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as σtd, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as σte, a ratio (σte/σtd) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10≤σte/σtd≤1.35.
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