Invention Grant
- Patent Title: Metal-clad laminate and printed wiring board
-
Application No.: US17621011Application Date: 2020-06-19
-
Publication No.: US11638349B2Publication Date: 2023-04-25
- Inventor: Dai Sasaki , Yasunori Nishiguchi , Kazuki Matsumura , Yohsuke Ishikawa , Hiroki Tamiya , Koji Kishino
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2019-119108 20190626
- International Application: PCT/JP2020/024182 WO 20200619
- International Announcement: WO2020/262245 WO 20201230
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/05

Abstract:
A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.
Public/Granted literature
- US20220353988A1 METAL-CLAD LAMINATE AND PRINTED WIRING BOARD Public/Granted day:2022-11-03
Information query