- 专利标题: Semiconductor structure and manufacturing method thereof
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申请号: US17347614申请日: 2021-06-15
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公开(公告)号: US11640981B2公开(公告)日: 2023-05-02
- 发明人: Shin-Hung Li
- 申请人: UNITED MICROELECTRONICS CORP.
- 申请人地址: TW Hsin-Chu
- 专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人地址: TW Hsin-Chu
- 代理商 Winston Hsu
- 优先权: CN202110521137.1 20210513
- 主分类号: H01L29/423
- IPC分类号: H01L29/423 ; H01L29/78 ; H01L29/40 ; H01L29/66 ; H01L21/265 ; H01L21/28
摘要:
The invention provides a semiconductor structure, the semiconductor structure includes a substrate, two shallow trench isolation structures are located in the substrate, a first region, a second region and a third region are defined between the two shallow trench isolation structures, the second region is located between the first region and the third region. Two thick oxide layers are respectively located in the first region and the third region and directly contact the two shallow trench isolation structures respectively, and a thin oxide layer is located in the second region, the thickness of the thick oxide layer in the first region is greater than that of the thin oxide layer in the second region.
公开/授权文献
- US20220367653A1 Semiconductor structure and manufacturing method thereof 公开/授权日:2022-11-17
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