Invention Grant
- Patent Title: Single message management platform
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Application No.: US17940870Application Date: 2022-09-08
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Publication No.: US11641335B2Publication Date: 2023-05-02
- Inventor: Bhumika Chhabra , Swetha Barkam , Kathryn H. Russo , Zhao Zhao
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H04L51/42
- IPC: H04L51/42 ; H04W4/14 ; H04L51/216 ; H04L51/10 ; H04L51/214

Abstract:
Methods and devices related to a single message management platform are described. In an example, a method can include receiving a first message at a first processing resource via a first application, receiving a second message at the first processing resource via a second application, receiving the first message and the second message at a memory, storing the first message and the second message in the memory, receiving a command to open a single message management platform, receiving the first message and the second message at the single message management platform, and organizing the first message and the second message at the single message management platform.
Public/Granted literature
- US20230006962A1 SINGLE MESSAGE MANAGEMENT PLATFORM Public/Granted day:2023-01-05
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