Invention Grant
- Patent Title: Punching device
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Application No.: US17231001Application Date: 2021-04-15
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Publication No.: US11642717B2Publication Date: 2023-05-09
- Inventor: Masayuki Takahashi , Keitaro Fujii
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP 2020074944 2020.04.20
- Main IPC: B21D28/18
- IPC: B21D28/18 ; B21D28/14

Abstract:
There is provided a punching device for punching a workpiece into a predetermined shape using a die and a punch, the device including: load sensors which measure a load in a punching direction at at least three predetermined points different from each other; and a control device that calculates a first moment, which is a sum of moments of the measured load around a first axis, and a second moment, which is a sum of moments of the measured load around a second axis, with respect to the first and second axes on a plane perpendicular to the punching direction, and determines that foreign matter is generated in a case where a magnitude of at least one of the first and second moments is deviated from a range of predetermined values.
Public/Granted literature
- US20210323043A1 PUNCHING DEVICE Public/Granted day:2021-10-21
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