Invention Grant
- Patent Title: Light emitting diode package and display apparatus including the same
-
Application No.: US17189635Application Date: 2021-03-02
-
Publication No.: US11645971B2Publication Date: 2023-05-09
- Inventor: Kyoungjun Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20200076757 2020.06.23
- Main IPC: G09G3/32
- IPC: G09G3/32 ; H01L25/16 ; H01L23/00

Abstract:
A light-emitting diode (LED) package includes a first LED pixel including a plurality of first LED chips and a first pixel driving integrated circuit to drive the first LED chips according to an active matrix (AM) mode using entirety of a first frame period, wherein the first pixel driving integrated circuit includes a first storage area configured to store first frame data of each first LED chip, a second storage area configured to store duty ratio compensation data of each first LED chip, a pulse width modulation (PWM) data calculator configured to perform an arithmetic operation on the first frame data and the duty ratio compensation data to generate PWM data, and a PWM data generator configured to adjust an emission duty ratio based on the PWM data.
Public/Granted literature
- US20210398479A1 LIGHT EMITTING DIODE PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME Public/Granted day:2021-12-23
Information query
IPC分类: