Invention Grant
- Patent Title: Sound processing method, sound processing apparatus, and recording medium
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Application No.: US17014312Application Date: 2020-09-08
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Publication No.: US11646044B2Publication Date: 2023-05-09
- Inventor: Ryunosuke Daido , Hiraku Kayama
- Applicant: YAMAHA CORPORATION
- Applicant Address: JP Hamamatsu
- Assignee: YAMAHA CORPORATION
- Current Assignee: YAMAHA CORPORATION
- Current Assignee Address: JP Hamamatsu
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP 2018043116 2018.03.09
- Main IPC: G10L21/01
- IPC: G10L21/01 ; G10L13/033

Abstract:
A method obtains a first sound signal representative of a first sound, including a first spectrum envelope contour and a first reference spectrum envelope contour; obtains a second sound signal, representative of a second sound differing in sound characteristics from the first sound, including a second spectrum envelope contour and a second reference spectrum envelope contour; generates a synthesis spectrum envelope contour by transforming the first spectrum envelope contour based on a first difference between the first spectrum envelope contour and the first reference spectrum envelope contour at a first time point of the first sound signal, and a second difference between the second spectrum envelope contour and the second reference spectrum envelope contour at a second time point of the second sound signal; and generates a third sound signal representative of the first sound that has been transformed using the generated synthesis spectrum envelope contour.
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