Invention Grant
- Patent Title: Coil electronic component
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Application No.: US16525726Application Date: 2019-07-30
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Publication No.: US11646150B2Publication Date: 2023-05-09
- Inventor: Jae Hun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190043220 2019.04.12
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/32 ; H01F27/28

Abstract:
A coil electronic component includes a body having first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces to each other and opposing each other, an insulating substrate disposed in the body and including an end portion having one side surface exposed externally of the body, first and second coil portions disposed on one surface and the other surface of the insulating substrate opposing each other, respectively, a first lead-out portion connected to the first coil portion, disposed on one surface of the insulating substrate, and exposed from the body, a second lead-out portion connected to the first coil portion, disposed on the other surface of the insulating substrate, and exposed from the body, and a direction indicator disposed on at least one of one surface and the other surface of the end portion opposing each other.
Public/Granted literature
- US20200328023A1 COIL ELECTRONIC COMPONENT Public/Granted day:2020-10-15
Information query