Invention Grant
- Patent Title: Electronic devices having antennas with hybrid substrates
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Application No.: US17338481Application Date: 2021-06-03
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Publication No.: US11646501B2Publication Date: 2023-05-09
- Inventor: Jiangfeng Wu , Siwen Yong , Simon G. Begashaw , Yi Jiang , Lijun Zhang
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent Michael H. Lyons
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q1/38 ; H01Q3/26 ; H01Q19/00 ; H01Q21/06 ; H01Q1/24

Abstract:
An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.
Public/Granted literature
- US20220393365A1 Electronic Devices Having Antennas with Hybrid Substrates Public/Granted day:2022-12-08
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