Invention Grant
- Patent Title: Prepreg, metal-clad laminated board, and printed wiring board
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Application No.: US16095120Application Date: 2017-04-18
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Publication No.: US11647583B2Publication Date: 2023-05-09
- Inventor: Shimpei Obata , Ryuuji Takahashi , Yasunori Hoshino , Shigetoshi Fujita
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP 2016084034 2016.04.19
- International Application: PCT/JP2017/015528 2017.04.18
- International Announcement: WO2017/183621A 2017.10.26
- Date entered country: 2018-10-19
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B32B15/08 ; B32B5/28 ; C08J5/10 ; C08J5/24 ; H01L23/498 ; H05K1/02

Abstract:
A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.
Public/Granted literature
- US20190150279A1 PREPREG, METAL-CLAD LAMINATED BOARD, AND PRINTED WIRING BOARD Public/Granted day:2019-05-16
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