- Patent Title: Patterning of thin film capacitors in organic substrate packages
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Application No.: US16024715Application Date: 2018-06-29
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Publication No.: US11651902B2Publication Date: 2023-05-16
- Inventor: Rahul Jain , Andrew J. Brown , Prithwish Chatterjee , Sai Vadlamani , Lauren Link
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01G4/33 ; H01L49/02
Abstract:
Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.
Public/Granted literature
- US20200006005A1 PATTERNING OF THIN FILM CAPACITORS IN ORGANIC SUBSTRATE PACKAGES Public/Granted day:2020-01-02
Information query
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