Invention Grant
- Patent Title: Chip antenna
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Application No.: US17499212Application Date: 2021-10-12
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Publication No.: US11652272B2Publication Date: 2023-05-16
- Inventor: Jae Yeong Kim , Sung Nam Cho , Sung Yong An , Ji Hyung Jung , Chin Mo Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR 20190033918 2019.03.25 KR 20190112303 2019.09.10
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q9/40 ; H01Q9/04 ; H01Q21/06 ; H01Q1/48 ; H01Q1/38

Abstract:
A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.
Public/Granted literature
- US20220029274A1 CHIP ANTENNA Public/Granted day:2022-01-27
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