Invention Grant
- Patent Title: Wiring board and method for manufacturing wiring board
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Application No.: US17439326Application Date: 2020-03-19
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Publication No.: US11653444B2Publication Date: 2023-05-16
- Inventor: Naoko Okimoto , Mitsutaka Nagae , Kenichi Ogawa , Makiko Sakata , Toru Miyoshi
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo-to
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 2019053328 2019.03.20
- International Application: PCT/JP2020/012529 2020.03.19
- International Announcement: WO2020/189790A 2020.09.24
- Date entered country: 2021-09-14
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46

Abstract:
A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate.
Public/Granted literature
- US20220183150A1 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD Public/Granted day:2022-06-09
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