Invention Grant
- Patent Title: Laminated plate
-
Application No.: US16354936Application Date: 2019-03-15
-
Publication No.: US11653446B2Publication Date: 2023-05-16
- Inventor: Koichi Shimauchi , Yoshitsugu Furui
- Applicant: NIPPON PILLAR PACKING CO., LTD.
- Applicant Address: JP Osaka
- Assignee: NIPPON PILLAR PACKING CO., LTD.
- Current Assignee: NIPPON PILLAR PACKING CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Millen, White, Zelano & Branigan, PC
- Agent Ryan Pool
- Priority: JP 2018049383 2018.03.16
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B32B15/085 ; C08L27/18 ; C08J9/00 ; H05K1/02 ; B32B15/20
Abstract:
A laminated plate has a metallic conductive layer layered on one surface or each surface of an insulating substrate, the insulating substrate contains a fluorine resin and a polymer of an alkoxysilane, and the fluorine resin is dispersed in the polymer of the alkoxysilane.
Public/Granted literature
- US20190289713A1 LAMINATED PLATE Public/Granted day:2019-09-19
Information query
