Invention Grant
- Patent Title: Electrostatic detections
-
Application No.: US17386411Application Date: 2021-07-27
-
Publication No.: US11656261B2Publication Date: 2023-05-23
- Inventor: Nick Thamma , Pei Hsuan Li , Sze Hau Loh
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: G01R29/14
- IPC: G01R29/14 ; G01R29/24 ; H05K1/11 ; G06F3/01

Abstract:
In some examples, an electronic device includes a printed circuit board. In some examples, the printed circuit board includes a conductive base layer. In some examples, the conductive base layer is an electrode to produce a signal indicative of a change in an omnidirectional electrostatic field corresponding to a moving object. In some examples, the printed circuit board includes a via coupled to the conductive base layer. In some examples, the via is disposed through an intermediate layer of the printed circuit board. In some examples, the printed circuit board includes an integrated circuit coupled to the via. In some examples, the integrated circuit is to detect, using a machine learning model, a direction of the moving object in the omnidirectional electrostatic field based on a feature of the signal.
Public/Granted literature
- US20230035435A1 ELECTROSTATIC DETECTIONS Public/Granted day:2023-02-02
Information query