Invention Grant
- Patent Title: Surface profile estimation and bump detection for autonomous machine applications
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Application No.: US17103680Application Date: 2020-11-24
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Publication No.: US11657532B2Publication Date: 2023-05-23
- Inventor: Minwoo Park , Yue Wu , Michael Grabner , Cheng-Chieh Yang
- Applicant: NVIDIA Corporation
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Taylor English Duma L.L.P.
- Main IPC: G06T7/60
- IPC: G06T7/60 ; G06T7/579 ; G06V20/56

Abstract:
In various examples, surface profile estimation and bump detection may be performed based on a three-dimensional (3D) point cloud. The 3D point cloud may be filtered in view of a portion of an environment including drivable free-space, and within a threshold height to factor out other objects or obstacles other than a driving surface and protuberances thereon. The 3D point cloud may be analyzed—e.g., using a sliding window of bounding shapes along a longitudinal or other heading direction—to determine one-dimensional (1D) signal profiles corresponding to heights along the driving surface. The profile itself may be used by a vehicle—e.g., an autonomous or semi-autonomous vehicle—to help in navigating the environment, and/or the profile may be used to detect bumps, humps, and/or other protuberances along the driving surface, in addition to a location, orientation, and geometry thereof.
Public/Granted literature
- US20210183093A1 SURFACE PROFILE ESTIMATION AND BUMP DETECTION FOR AUTONOMOUS MACHINE APPLICATIONS Public/Granted day:2021-06-17
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