Invention Grant
- Patent Title: Memory card including interconnection terminals
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Application No.: US17231521Application Date: 2021-04-15
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Publication No.: US11657855B2Publication Date: 2023-05-23
- Inventor: Injae Lee , Seungwan Koh
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR 20200119593 2020.09.17
- Main IPC: G11C5/06
- IPC: G11C5/06 ; G11C7/10 ; G11C5/14 ; G06F13/16 ; H01L23/528

Abstract:
A memory card includes a plurality of interconnection terminals aligned in a row direction and a column direction on a substrate. Each of the plurality of interconnection terminals has a first-axis length equal to no more than 1.2 time that of a second-axis length thereof. A non-volatile memory device is disposed on the substrate. The non-volatile memory device is electrically connected to at least one interconnection terminal corresponding thereto from among the plurality of interconnection terminals.
Public/Granted literature
- US20220084559A1 MEMORY CARD INCLUDING INTERCONNECTION TERMINALS Public/Granted day:2022-03-17
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