Invention Grant
- Patent Title: Nonvolatile memory devices including memory planes and memory systems including the same
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Application No.: US17338097Application Date: 2021-06-03
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Publication No.: US11657858B2Publication Date: 2023-05-23
- Inventor: Hyun-Jin Kim , Chung-Ho Yu , Yong-Kyu Lee , Jae-Yong Jeong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR 20180150016 2018.11.28
- Main IPC: G11C7/10
- IPC: G11C7/10

Abstract:
A nonvolatile memory device may include a plurality of memory planes and a plurality of plane-dedicated pad sets. The plurality of memory planes may include a plurality of memory cell arrays including nonvolatile memory cells and a plurality of page buffer circuits. Each of the plurality of page buffer circuits may be connected to ones of the nonvolatile memory cells included in each of the plurality of memory cell arrays through bitlines. A plurality of plane-dedicated pad sets may be connected to the plurality of page buffer circuits through a plurality of data paths respectively such that each of the plurality plane-dedicated pad sets is dedicatedly connected to each of the plurality of page buffer circuits. A bandwidth of a data transfer may be increased by reducing a data transfer delay and supporting a parallel data transfer, and power consumption may be decreased by removing data multiplexing and/or signal routing.
Public/Granted literature
- US20210295884A1 NONVOLATILE MEMORY DEVICES INCLUDING MEMORY PLANES AND MEMORY SYSTEMS INCLUDING THE SAME Public/Granted day:2021-09-23
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