发明授权
- 专利标题: Electronic module
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申请号: US16078602申请日: 2017-07-14
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公开(公告)号: US11658109B2公开(公告)日: 2023-05-23
- 发明人: Kosuke Ikeda , Osamu Matsuzaki
- 申请人: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- 当前专利权人: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Ladas & Parry, LLP
- 国际申请: PCT/JP2017/025641 2017.07.14
- 国际公布: WO2019/012678A 2019.01.17
- 进入国家日期: 2018-08-21
- 主分类号: H01L23/498
- IPC分类号: H01L23/498 ; H01L23/495 ; H01L23/538 ; H01L23/00 ; H01L25/07
摘要:
An electronic module has a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 provided on a side of the first substrate 11 and a second terminal part 120 provided on a side of the second substrate 21. The first terminal part 110 has a first surface direction extending part 114 and a first normal direction extending part 113 extending toward one side or the other side. The second terminal part 120 has a second surface direction extending part 124 and a second normal direction extending part 123 extending toward one side or the other side. The second surface direction extending part 124 is provided on one side of the first surface direction extending part 114, and the first surface direction extending part 114 and the second surface direction extending part 124 overlap one another in a surface direction.
公开/授权文献
- US20210210422A1 ELECTRONIC MODULE 公开/授权日:2021-07-08
信息查询
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