- Patent Title: Semiconductor device including uneven contact in passivation layer
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Application No.: US17679122Application Date: 2022-02-24
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Publication No.: US11658138B2Publication Date: 2023-05-23
- Inventor: Yen-Jui Chu , Jin-Neng Wu
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- The original application number of the division: US16929109 2020.07.15
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.
Public/Granted literature
- US20220181282A1 SEMICONDUCTOR DEVICE INCLUDING UNEVEN CONTACT IN PASSIVATION LAYER Public/Granted day:2022-06-09
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