Invention Grant
- Patent Title: Array substrate and display device
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Application No.: US16633064Application Date: 2019-08-01
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Publication No.: US11658186B2Publication Date: 2023-05-23
- Inventor: Hongfei Cheng
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg
- Priority: CN 1821266166.8 2018.08.07
- International Application: PCT/CN2019/098895 2019.08.01
- International Announcement: WO2020/029865A 2020.02.13
- Date entered country: 2020-01-22
- Main IPC: H01L27/12
- IPC: H01L27/12 ; G02F1/1362

Abstract:
The present disclosure provides an array substrate, including: a base, and at least one lead structure disposed on the base. The lead structure includes a first conductive structure and a conductive semiconductor structure, and an orthographic projection of the conductive semiconductor structure on the base at least partially overlaps an orthographic projection of the first conductive structure on the base.
Public/Granted literature
- US20210066350A1 ARRAY SUBSTRATE AND DISPLAY DEVICE Public/Granted day:2021-03-04
Information query
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