Invention Grant
- Patent Title: Combining signals from multiple sensors to facilitate EMI fingerprint characterization of electronic systems
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Application No.: US17090131Application Date: 2020-11-05
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Publication No.: US11663369B2Publication Date: 2023-05-30
- Inventor: Matthew T. Gerdes , Kenny C. Gross , Guang C. Wang , Shreya Singh , Aleksey M. Urmanov
- Applicant: Oracle International Corporation
- Applicant Address: US CA Redwood Shores
- Assignee: Oracle International Corporation
- Current Assignee: Oracle International Corporation
- Current Assignee Address: US CA Redwood Shores
- Agency: Park, Vaughan, Fleming & Dowler LLP
- Main IPC: G06F21/00
- IPC: G06F21/00 ; G06F21/88

Abstract:
During operation, the system uses N sensors to sample an electromagnetic interference (EMI) signal emitted by a target asset while the target asset is running a periodic workload, wherein each of the N sensors has a sensor sampling frequency f, and wherein the N sensors perform sampling operations in a round-robin ordering with phase offsets between successive samples. During the sampling operations, the system performs phase adjustments among the N sensors to maximize phase offsets between successive sensors in the round-robin ordering. Next, the system combines samples obtained through the N sensors to produce a target EMI signal having an EMI signal sampling frequency F=f×N. The system then generates a target EMI fingerprint from the target EMI signal. Finally, the system compares the target EMI fingerprint against a reference EMI fingerprint for the target asset to determine whether the target asset contains any unwanted electronic components.
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