Invention Grant
- Patent Title: Circuit board, method for manufacturing circuit board, and electronic device
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Application No.: US17598530Application Date: 2020-03-27
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Publication No.: US11665816B2Publication Date: 2023-05-30
- Inventor: Zhi Yuan , Guo Yang , Jian Shi , Linfang Jin , Zhen Xu
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Priority: CN 1910246175.3 2019.03.28
- International Application: PCT/CN2020/081527 2020.03.27
- International Announcement: WO2020/192744A 2020.10.01
- Date entered country: 2021-09-27
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46
Abstract:
In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.
Public/Granted literature
- US20220183146A1 Circuit Board, Method for Manufacturing Circuit Board, and Electronic Device Public/Granted day:2022-06-09
Information query
