Invention Grant
- Patent Title: Hinge module and foldable electronic device including the same
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Application No.: US16794666Application Date: 2020-02-19
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Publication No.: US11665841B2Publication Date: 2023-05-30
- Inventor: Dooryong Kim , Jongmin Kang , Jungjin Kim , Jongyoon Kim , Inyoul Baek , Chungkeun Yoo , Doosun Yoon , Suman Lee , Jonghwan Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR 20190019574 2019.02.19
- Main IPC: H05K5/02
- IPC: H05K5/02 ; F16C11/04 ; E05D11/00 ; E05D11/06
Abstract:
Disclosed is a hinge module a hinge structure for a wireless communication device, the hinge structure preventing a rotary structure from being separated from a fixed structure in a flat state and a folded state.
Public/Granted literature
- US20200267859A1 HINGE MODULE AND FOLDABLE ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2020-08-20
Information query
