Invention Grant
- Patent Title: Selectively lifting substrates
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Application No.: US17257331Application Date: 2018-11-15
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Publication No.: US11666935B2Publication Date: 2023-06-06
- Inventor: Chen Zigdon , Daniel Skvirsky , Roy Beeri , Liora Braun
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2018/061176 2018.11.15
- International Announcement: WO2020/101678A 2020.05.22
- Date entered country: 2020-12-31
- Main IPC: B05C1/08
- IPC: B05C1/08 ; B41J15/04 ; B65H20/02 ; B65H23/28 ; B41J11/00

Abstract:
Example implementations relate to selectively deflecting substrates. One example implementation includes an apparatus to selectively lift a part of a substrate away from a transfer member when the substrate is advancing in a substrate coating system relative to the transfer member, such that, across a width of the substrate, a first part of the substrate is coated by the transfer member and a second part of the substrate, that is lifted by the apparatus, remains uncoated.
Public/Granted literature
- US20210276037A1 SELECTIVELY LIFTING SUBSTRATES Public/Granted day:2021-09-09
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