Invention Grant
- Patent Title: Induction heating device having improved cooling structure
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Application No.: US16182780Application Date: 2018-11-07
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Publication No.: US11672056B2Publication Date: 2023-06-06
- Inventor: Hoon Seob Sim , Jaekyung Yang , Se Mi Lee , Yongsoo Lee , Hakjoo Lim
- Applicant: LG Electronics Inc.
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Fish & Richardson P.C.
- Priority: KR 20180034068 2018.03.23
- Main IPC: H05B6/42
- IPC: H05B6/42 ; F04D13/06 ; F04D29/60 ; F28D15/02 ; F24C15/10 ; H05B6/12

Abstract:
An induction heating device includes a casing; a first induction heating module in the casing; a first heat sink located below the first induction heating module; a first heat pipe that passes through the first heat sink, that extends outward from the first induction heating module, and that is configured to discharge heat from the first heat sink out of the first induction heating module; an air-discharge fan located at an inner side of the casing and configured to discharge air from inside of the casing to outside of the casing; and a cooling fan located at the inner side of the casing and configured to blow air to the air-discharge fan. The first heat pipe has an end that protrudes from the first induction heating module and that is located at an air-flow path defined between the cooling fan and the air-discharge fan.
Public/Granted literature
- US20190297689A1 INDUCTION HEATING DEVICE HAVING IMPROVED COOLING STRUCTURE Public/Granted day:2019-09-26
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