Invention Grant
- Patent Title: Sewing device and sewing method
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Application No.: US17261586Application Date: 2019-06-28
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Publication No.: US11674249B2Publication Date: 2023-06-13
- Inventor: Toru Takamura , Yosuke Ikadai , Mitsutaka Igaue
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Amin, Turocy & Watson, LLP
- Priority: JP 2018145779 2018.08.02
- International Application: PCT/JP2019/025918 2019.06.28
- International Announcement: WO2020/026667A 2020.02.06
- Date entered country: 2021-01-20
- Main IPC: D05B39/00
- IPC: D05B39/00 ; D05B31/00 ; D05B69/30

Abstract:
Provided are: a sewing device provided with a sewing mechanism which performs sewing on a work to be sewn using a sewing-machine needle, while holding the work to be sewn in a state of being shaped in a predetermined shape on a plurality of seating portions arranged in a sewing direction; and a sewing method. When the seating portions are withdrawn from the work to be sewn so as to avoid interference between the sewing mechanism and the seating portions, a guiding mechanism enables movement in a first withdrawing direction for avoiding a first undercut portion of the work to be sewn, and movement in a second withdrawing direction for avoiding a second undercut portion of the work to be sewn.
Public/Granted literature
- US20210292951A1 SEWING DEVICE AND SEWING METHOD Public/Granted day:2021-09-23
Information query