Invention Grant
- Patent Title: Semiconductor device structure and methods of forming the same
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Application No.: US17005172Application Date: 2020-08-27
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Publication No.: US11676864B2Publication Date: 2023-06-13
- Inventor: Kuan-Ting Pan , Kuo-Cheng Chiang , Shi-Ning Ju , Shang-Wen Chang , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: NZ Carr Law Office
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L27/088

Abstract:
A semiconductor device structure, along with methods of forming such, are described. The structure includes a first fin, a second fin adjacent the first fin, and a third fin adjacent the second fin. The structure further includes a first source/drain epitaxial feature merged with a second source/drain epitaxial feature. The structure further includes a third source/drain epitaxial feature, and a first liner positioned at a first distance away from a first plane defined by a first sidewall of the first fin and a second distance away from a second plane defined by a second sidewall of the second fin. The first distance is substantially the same as the second distance, and the merged first and second source/drain epitaxial features is disposed over the first liner. The structure further includes a dielectric feature disposed between the second source/drain epitaxial feature and the third source/drain epitaxial feature.
Public/Granted literature
- US20220068716A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME Public/Granted day:2022-03-03
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